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Different PVD deposition processes

Time:2019-05-05 19:11:57  From:  Author:

 The bond structure in transition metal nitrides consists of a mixture of covalent, metallic and ionic components, and is responsible for high hardness, excellent wear resistance, chemical inertness, good electrical conductivity and superconducting properties. The interest in thin films of metal nitrides is growing rapidly for such diverse applications as wear resistant coatings on cutting tools, selective transmission coatings on architectural glass, and as diffusion barriers in integrated circuits. Of the transition metal nitrides, processing techniques, properties and applications of titanium nitride (TiN) have been investigated extensively. It is well established that (Ti,Al)N coating enhances wear and oxidation resistance of tools, while overcoming the shortcomings of TiN and TiCN coatings . In this paper, we review deposition of (Ti,Al)N coatings and compare the properties and performance of different titanium based coatings. In addition, the recent works on titanium based multicomponent and multilayer coatings are also discussed.

In physical vapor deposition (PVD) processes, the coating is deposited in vacuum by condensation from a flux of neutral or ionized atoms of metals. Several PVD techniques are available for deposition of hard coatings. Among them, cathodic arc vapor (plasma or arc ion plating) deposition, magnetron sputtering (or sputter ion plating) , and combined magnetron and arc processes are the most widely used techniques to deposit titanium/aluminum based coatings. These PVD processes differ with respect to the type of evaporation of the metallic components and the plasma conditions employed during the deposition process. The transition of the metallic component (to be deposited) from a solid to a vapor phase (in which metal atoms are ionized in different ways) may be performed by heating of an evaporation source (as in cathodic arc) or by sputtering of a target (as in magnetron sputtering). Cathodic arc and magnetron sputtering techniques allow evaporation of metals with different melting points such as Ti and Al from a Ti/Al alloy cathode/target2 . The PVD arc evaporation process employs a higher energy input than the PVD sputtering process. In the case of arc evaporation, a small limited cathodic area is evaporated with a very high-energy arc that quickly moves over a spot on the metal surface to be evaporated. The plasma generated consists of highly ionized metal vapor . In the case of sputtering, atoms are ejected mechanically from a target by the impact of ions or energetic neutral atoms.


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