Formation of splat morphology during thermalspraying
V.V Sobolev
Materials Letters
Abstract
Mechanisms of splashing of droplets impinging onto the substrate surface during thermalspraying are considered. Supercooling formed in the flattening droplet is shown to consist of thermal supercooling, which occurred due to the high pressure developed upon droplet impact. Solidification starts when the supercooling exceeds some critical value. For a `cold' substrate, i.e., a substrate whose temperature is less than a transition temperature, the marked contribution to supercooling is due to the high pressure term. In this case a regular disc-shaped splat will be formed in the central part of the flattening droplet and splashing will occur in the periphery. For a `hot' substrate, i.e., a substrate whose temperature exceeds the transition temperature, thermal supercooling is sufficiently high, no splashing occurs and a regular disc-shaped splat is formed. Theoretical results agree with the experimental observations.
keywords:Thermalspraying; Splat formation; Supercooling
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